HyperTransport 3.1 Interconnect Technology:
by Brian Holden, Jay Trodden, Don Anderson

HyperTransportTM technology has revolutionized microprocessor core interconnect. It serves as the central interconnect technology for nearly all of AMDs microprocessors as well as for a rich ecosystem of other microprocessors, system controllers, graphics processors, network processors, and communications semiconductors. It is a high-speed, low latency, point-to-point, packetized link. The latest version, HyperTransport 3.1, enables data transfer at rates of up to 51.2 GigaBytes per second. It is scalable, error tolerant, and designed for ease of use. It is also compatible with PCIe, PCI-X, PCI, and AGP buses and includes comprehensive power management and x86 platform support. The HTX and HTX3 specifications define a PC architecture I/O slot that provides the lowest latency slot access to a microprocessor available.

MindShare's HyperTransport 3.1 Interconnect Technology provides a comprehensive guide to all of the releases of HyperTransport technology, from 1.03, through 2.0, to 3.1. This book includes over 250 drawings and over 100 tables.

Key Topics:

Physical signals

Packet protocol

Flow control

I/O Ordering Rules

Interrupts

Error detection and error handling

System management messaging and protocols

Power management messaging and protocols

Packet routing algorithms including fairness

Device configuration

Electrical interface power and signaling

Signal equalization and phase alignment

Channel specification and modeling

HyperTransport bridging and switching

PCIe, PCI-X, PCI, AGP and x86 compatibility

Additional topics covered include:

The HTX and HTX3 slots

Server platform design

A history of HyperTransport

Terminology through a detailed glossary

MindShare's Technology Series is a crisply written and comprehensive set of guides to the most important computer hardware standards. Books in the series are intended for use by hardware and software designers, programmers, and support personnel.

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Publisher: MindShare, Inc.
Page Count (est.): 690
ISBN10: 0977087824
ISBN13: 9780977087822
Cover: Paperback
Pub Date: 9/17/2008